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Forming the Future
In this collection, scientists and engineers from across industry, academia, and government present their latest improvements and innovations in all aspects of metal forming science and technology, with the intent of facilitating linkages and collaborations among these groups. Chapters cover the breadth of metal forming topics, from fundamental science to industrial application.
Simulation of the thermoforming process of UD fiber-reinforced thermoplastic tape laminates
In this work, initially, the requirements on a simulation model of the non-isothermal stamp forming process of unidirectional fiber-reinforced, and thermoplastic tape laminates are investigated experimentally. On this basis, different isothermal as well as a fully coupled thermomechanical simulation model under consideration of the crystallization kinetics are developed. For validation, a complex shaped geometry is simulated and compared to experimental forming results.
Applied Micromechanics of Complex Microstructures
Applied Micromechanics of Complex Microstructures explains the fundamental concepts of continuum modeling of various complicated microstructures, covering nanocomposites, multiphase composites, biomaterials, biological materials, and more. The authors outline the calculation of effective mechanical and thermal properties, allowing readers to understand the step-by-step modeling and homogenization of complicated microstructures, and the book also features a chapter on microstructure hull and material design. Modeling of complex samples with nonlinear properties such as neural tissue, bone microstructure, and liver tissue is also explained and analyzed. Explains the core concepts of continuum modeling of different complex microstructures, including nanocomposites, multiphase composites, biomaterials, and biological materials Provides detailed calculations of eff ective mechanical and thermal properties allowing the audience to understand the modeling and homogenization of complex microstructures Covers several methods for designing the microstructure of heterogeneous materials
Fundamentals of Lead-Free Solder Interconnect Technology
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Mechanical, Materials and Manufacturing Engineering
Proceedings of the 2011 International Conference on Mechanical Materials and Manufacturing Engineering (ICMMME 2011), June 20-22, 2011, Nanchang, China. Volume is indexed by Thomson Reuters CPCI-S (WoS). The objective of ICMMME 2011, with its more than 427 papers, was to provide a forum for researchers, educators, engineers and government officials involved in the general areas of mechanical materials and manufacturing engineering; thus permitting them to disseminate their latest research results and to exchange views on the future research directions of these fields.
Flexible Towpregs and Their Thermoplastic Composites
Thermoplastic matrix composites have attracted much attention in the composites industry due to their easy processibility and improved impact properties. Although there are many books on thermoplastic composites available, none emphasize flexible towpregs and their composite properties. This book discusses various methods of manufacturing flexible towpregs, their properties, their textile preforming behavior, the properties of textile preform, and the properties of final composites. FEATURES Gives readers a complete view of composite manufacturing Offers details on flexible prepregs that other books overlook, such as manufacturing methods, influence of processing parameters, and properties I...
