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Tribology Issues and Opportunities in MEMS
  • Language: en
  • Pages: 652

Tribology Issues and Opportunities in MEMS

Micro Electro Mechanical Systems (MEMS) is already about a billion dollars a year industry and is growing rapidly. So far major emphasis has been placed on the fabrication processes for various devices. There are serious issues related to tribology, mechanics, surfacechemistry and materials science in the operationand manufacturingof many MEMS devices and these issues are preventing an even faster commercialization. Very little is understood about tribology and mechanical properties on micro- to nanoscales of the materials used in the construction of MEMS devices. The MEMS community needs to be exposed to the state-of-the-artoftribology and vice versa. Fundamental understanding of friction/s...

Advances in Materials Science for Environmental and Energy Technologies
  • Language: en
  • Pages: 234

Advances in Materials Science for Environmental and Energy Technologies

With contributed papers from the 2011 Materials Science and Technology symposia, this is a useful one-stop resource for understanding the most important issues in advances in materials science for environmental and energy technologies. Logically organized and carefully selected, the articles cover the themes of the symposia: Green Technologies for Materials Manufacturing and Processing; Materials Science Challenges for Nuclear Applications; Materials for Nuclear Waste Disposal and Environmental Cleanup; Energy Conversion/Fuel Cells; and Energy Storage: Materials, Systems and Applications.

RF and Microwave Microelectronics Packaging
  • Language: en
  • Pages: 295

RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Additive Manufacturing of Structural Electronics
  • Language: en
  • Pages: 154

Additive Manufacturing of Structural Electronics

Additive manufacturing, also called rapid prototyping or 3D printing is a disruptive manufacturing technique with a significant impact in electronics. With 3D printing, bulk objects with circuitry are embedded in the volume of an element or conformally coated on the surface of existing parts, allowing design and manufacturing of smaller and lighter products with fast customisation. The book covers both materials selection and techniques. The scope also covers the research areas of additive manufacturing of passive and active components, sensors, energy storage, bioelectronics and more.

Characterization and Control of Interfaces for High Quality Advanced Materials II
  • Language: en
  • Pages: 492

Characterization and Control of Interfaces for High Quality Advanced Materials II

This volume includes papers from the Second International Conference on Characterization and Control of Interfaces for High Quality Advanced Materials, and Joining Technology for New Metallic Glasses and Inorganic Materials (ICCCI2006) in Kurashiki, Japan, 2006. Interfaces are critically important to a broad spectrum of materials and technologies. This Proceedings of ICCCI 2006 features 71 peer-reviewed papers on interface characterization and control technology for materials synthesis, powder processing, composite processing, joining, and to control airborne particulates.

Springer Handbook of Nanotechnology
  • Language: en
  • Pages: 1232

Springer Handbook of Nanotechnology

This major work has established itself as the definitive reference in the nanoscience and nanotechnology area in one volume. In presents nanostructures, micro/nanofabrication, and micro/nanodevices. Special emphasis is on scanning probe microscopy, nanotribology and nanomechanics, molecularly thick films, industrial applications and microdevice reliability, and on social aspects. Reflecting further developments, the new edition has grown from six to eight parts. The latest information is added to fields such as bionanotechnology, nanorobotics, and NEMS/MEMS reliability. This classic reference book is orchestrated by a highly experienced editor and written by a team of distinguished experts for those learning about the field of nanotechnology.

Official Gazette of the United States Patent and Trademark Office
  • Language: en
  • Pages: 892

Official Gazette of the United States Patent and Trademark Office

  • Type: Book
  • -
  • Published: 2002
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  • Publisher: Unknown

None

College of Engineering
  • Language: en
  • Pages: 614

College of Engineering

None

Bionanotechnology II
  • Language: en
  • Pages: 587

Bionanotechnology II

  • Type: Book
  • -
  • Published: 2011-08-25
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  • Publisher: CRC Press

The impact and importance of nanotechnology continues to grow, and nanomedicine and biotechnology have become areas of increased development. Biomedical engineers who work with biological processes and structures must have a deeply rooted understanding of the role of bionanotechnology, a rapidly evolving sector of the nanotechnology field. Bionanot