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The field of electron and ion optics is based on the analogy between geometrical light optics and the motion of charged particles in electromagnetic fields. The spectacular development of the electron microscope clearly shows the possibilities of image formation by charged particles of wavelength much shorter than that of visible light. As new applications such as particle accelerators, cathode ray tubes, mass and energy spectrometers, microwave tubes, scanning-type analytical instruments, heavy beam technologies, etc. emerged, the scope of particle beam optics has been exten ded to the formation of fine probes. The goal is to concentrate as many particles as possible in as small a volume as...
This is an expanded and revised second edition, presenting accurate and comprehensive information about our leading thermal scientists to current and future generations. In our globalized world, most researchers in thermal analysis do not know each other in person and are not familiar with each other’s achievements. This volume provides the reader with an up-to-date list of the prominent members in this community. The publication contains only living scientists. The selection is based partly on several decades of the editors' personal professional experience and also partly on the opinion of the Regional Editors of the Journal of Thermal Analysis and Calorimetry.
This book is devoted to the physics of electron-beam, ion-beam, optical, and x-ray lithography. The need for this book results from the following considerations. The astonishing achievements in microelectronics are in large part connected with successfully applying the relatively new technology of processing (changing the prop erties of) a material into a device whose component dimensions are submicron, called photolithography. In this method the device is imaged as a pattern on a metal film that has been deposited onto a transparent substrate and by means of a broad stream of light is transferred to a semiconductor wafer within which the physical structure of the devices and the integrated circuit connections are formed layer by layer. The smallest dimensions of the device components are limited by the diffraction of the light when the pattern is transferred and are approximately the same as the wavelength of the light. Photolithography by light having a wavelength of A ~ 0.4 flm has made it possible to serially produce integrated circuits having devices whose minimal size is 2-3 flm in the 4 pattern and having 10-105 transistors per circuit.
In the first comprehensive treatment of these technologically important materials, the authors provide theories linking the properties of semiconductor alloys to their constituent compounds. Topics include crystal structures, bonding, elastic properties, phase diagrams, band structures, transport, ab-initio theories, and semi-empirical theories. Each chapter includes extensive tables and figures as well as problem sets.
This comprehensive chronological reference work lists the results of men's chess competitions all over the world--individual and team matches, 1956 through 1960. Entries record location and, when available, the group that sponsored the event. First and last names of players are included whenever possible and are standardized for easy reference. Compiled from contemporary sources such as newspapers, periodicals, tournament records and match books, this work contains 1,390 tournament crosstables and 142 match scores. It is indexed by events and by players.
The advent of the microelectronics technology has made ever-increasing numbers of small devices on a same chip. The rapid emergence of ultra-large-scaled-integrated (ULSI) technology has moved device dimension into the sub-quarter-micron regime and put more than 10 million transistors on a single chip. While traditional closed-form analytical models furnish useful intuition into how semiconductor devices behave, they no longer provide consistently accurate results for all modes of operation of these very small devices. The reason is that, in such devices, various physical mechanisms affect the device performance in a complex manner, and the conventional assumptions (i. e. , one-dimensional t...
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
The technological progress is closely related to the developments of various materials and tools made of those materials. Even the different ages have been defined in relation to the materials used. Some of the major attributes of the present-day age (i.e., the electronic materials’ age) are such common tools as computers and fiber-optic telecommunication systems, in which semiconductor materials provide vital components for various mic- electronic and optoelectronic devices in applications such as computing, memory storage, and communication. The field of semiconductors encompasses a variety of disciplines. This book is not intended to provide a comprehensive description of a wide range o...
Present-day scienceand technology have become increasingly based on studies and applications of thin films. This is especiallytrue of solid-state physics, semiconduc tor electronics, integrated optics, computer science, and the like. In these fields, it is necessary to use filmswith an ordered structure, especiallysingle-crystallinefilms, because physical phenomena and effects in such films are most reproducible. Also, active parts of semiconductor and other devices and circuits are created, as a rule, in single-crystal bodies. To date, single-crystallinefilms have been mainly epitaxial (or heteroepitaxial); i.e., they have been grown on a single-crystalline substrate, and principal trends, ...