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Septième Réunion Du Sous-comité Ouest Et Centre Africain de Corrélation Des Sols Pour la Mise en Valeur Des Terres
This document contains the proceedings of a technical consultation on the soil resources information systems developed in the various countries in the European region and their incorporation into the European Soil Information System (EUSIS). The consultation was held in Rome 2-3 September 1999. It was convened by the European Commission and the FAO with support from the International Union of Soil Science. The purpose of the meeting was to promote the establishment of the EUSIS to enable easy inter-European exchange of data and experience and to facilitate problem solving. A summary report of the technical discussions, conclusions and recommendations are included. Detailed country reports are also included.
The Thorney Liber Vitae
First printed edition, with facsimile and studies, of a significant manuscript from medieval England.
Nanocarbon Electronics
This book presents a comprehensive review of research on applications of carbon nanotubes (CNTs) and graphene to electronic devices. As nanocarbons in general, and CNTs and graphene in particular, are becoming increasingly recognized as the most promising materials for future generations of electronic devices, including transistors, sensors, and interconnects, a knowledge gap still exists between the basic science of nanocarbons and their feasibility for cost-effective product manufacturing. The book highlights some of the issues surrounding this missing link by providing a detailed review of the nanostructure and electronic properties, materials, and device fabrication and of the structure–property–application relationships.
Soil-Water-Solute Process Characterization
The practitioner or researcher often faces complex alternatives when selecting a method to characterize properties governing a soil process. After years of research and development, environmental and agricultural professionals now have an array of methods for characterizing soil processes. Well-established methods, however, may not be suitable for
Copper Electrodeposition for Nanofabrication of Electronics Devices
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
AIDS and Other Manifestations of HIV Infection
Extensively revised and updated, the new edition of AIDS and Other Manifestations of HIV Infection is an essential reference resource providing a comprehensive overview of the biological properties of this etiologic viral agent, its clinicopathological manifestations, the epidemiology of its infection, and present and future therapeutic options. - Expanded section on clinical manifestations includes new chapters on cardiovascular, renal and dermatologic manifestations of HIV infection - Additional chapters on molecular diagnostic techniques, the role of host genetic variation in HIV infection and its manifestations, the discovery and development of new HIV medicines, analysis of HIV dynamics using mathematical models, toxicities of antiretroviral therapy, HIV drug susceptibility testing, practical therapeutics and the global impact of HIV and AIDS
Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
This issue of ECS Transactions covers emerging materials, process and technology options for large-area silicon wafers to enhance advanced IC performance or to enable revolutionary device structures with entirely new functionalities. Topics : high-mobility channel materials, (e.g. strained Si/Ge, compound semiconductors and graphene), high-performance gate stacks and low-resistivity junctions and contacts on new, Si-compatible materials; new materials and processes for 3-D (TSV) integration ; synthesis of nano-structures including wires, pores and membranes of Si-compatible materials; novel MEMS/NEMS structures and their integration with the mainstream Si-IC technology.
Electrodeposition of Nanoengineered Materials and Devices 2
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Electrodeposition of Nanoengineered Materials and Alloys 2¿, held during the 212th meeting of The Electrochemical Society, in Washington, DC, from October 7 to 12, 2007.
