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Semiconductor Packaging
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Materials for Electronics Security and Assurance
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable...
Semiconductor Packaging
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.
Dissertation Abstracts International
Abstracts of dissertations available on microfilm or as xerographic reproductions.
Classical And Quantum Dynamics In Condensed Phase Simulations: Proceedings Of The International School Of Physics
The school held at Villa Marigola, Lerici, Italy, in July 1997 was very much an educational experiment aimed not just at teaching a new generation of students the latest developments in computer simulation methods and theory, but also at bringing together researchers from the condensed matter computer simulation community, the biophysical chemistry community and the quantum dynamics community to confront the shared problem: the development of methods to treat the dynamics of quantum condensed phase systems.This volume collects the lectures delivered there. Due to the focus of the school, the contributions divide along natural lines into two broad groups: (1) the most sophisticated forms of the art of computer simulation, including biased phase space sampling schemes, methods which address the multiplicity of time scales in condensed phase problems, and static equilibrium methods for treating quantum systems; (2) the contributions on quantum dynamics, including methods for mixing quantum and classical dynamics in condensed phase simulations and methods capable of treating all degrees of freedom quantum-mechanically.
The Encyclopedia of Martial Arts Movies
The Encyclopedia covers the genre from 1920 to 1994. The genre, however, can be very confusing: films often have several titles, and many of the stars have more than one pseudonym. In an effort to clarify some of the confusion, the authors have included all the information available to them on almost 3,300 films. Each entry includes a listing of the production company, the cast and crew, distributors, running times, reviews with star ratings whenever possible, and alternate film titles. A list of film series and one of the stars' pseudonyms, in addition to a 7,900 name index, are also included. Illustrated.
Innovative Sense through Perspectives of Patent Bibliometrics Analysis
圖書資訊學中之計量研究，探討學術知識產出、影響與關聯等重要意義。研究以專利為分析標的，透過計量分析，解構產業技術知識的學術傳播意涵。
