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This book offers a comprehensive introduction to Subdivision Surface Modeling Technology focusing not only on fundamental theories but also on practical applications. It furthers readers’ understanding of the contacts between spline surfaces and subdivision surfaces, enabling them to master the Subdivision Surface Modeling Technology for analyzing subdivision surfaces. Subdivision surface modeling is a popular technology in the field of computer aided design (CAD) and computer graphics (CG) thanks to its ability to model meshes of any topology. The book also discusses some typical Subdivision Surface Modeling Technologies, such as interpolation, fitting, fairing, intersection, as well as trimming and interactive editing. It is a valuable tool, enabling readers to grasp the main technologies of subdivision surface modeling and use them in software development, which in turn leads to a better understanding of CAD/CG software operations.
This book highlights the basic theories and key technologies of error compensation for industrial robots. The chapters are arranged in the order of actual applications: establishing the robot kinematic models, conducting error analysis, conducting kinematic and non-kinematic calibrations, and planning optimal sampling points. To help readers effectively apply the technologies, the book elaborates the experiments and applications in robotic drilling and milling, which further verifies the effectiveness of the technologies. This book presents the authors’ research achievements in the past decade in improving robot accuracy. It is straightforwardly applicable for technical personnel in the aviation field, and provides valuable reference for researchers and engineers in various robotic applications.
"This book provides a comprehensive assessment of the latest developments in the EIS revolution. including Enterprise Resource Planning (ERP) adoption, the integration of enterprise systems, personalized ERP, and the Semantic Web, and ideas and solutions for the future of the global enterprise"--Provided by publisher.
This is the proceedings of the 11th International Workshop on Structural and Syntactic Pattern Recognition, SSPR 2006 and the 6th International Workshop on Statistical Techniques in Pattern Recognition, SPR 2006, held in Hong Kong, August 2006 alongside the Conference on Pattern Recognition, ICPR 2006. 38 revised full papers and 61 revised poster papers are included, together with 4 invited papers covering image analysis, character recognition, bayesian networks, graph-based methods and more.
The main objective of ICCSAI2013 is to provide a platform for the presentation of top and latest research results in global scientific areas. The conference aims to provide a high level international forum for researcher, engineers and practitioners to present and discuss recent advances and new techniques in computer science and artificial intelligence. It also serves to foster communications among researcher, engineers and practitioners working in a common interest in improving computer science, artificial intelligence and the related fields. We have received 325 numbers of papers through "Call for Paper", out of which 94 numbers of papers were accepted for publication in the conference proceedings through double blind review process. The conference is designed to stimulate the young minds including Research Scholars, Academicians, and Practitioners to contribute their ideas, thoughts and nobility in these two disciplines.
Additive manufacturing (AM) is one of the manufacturing processes that warrants the attention of industrialists, researchers and scientists, because of its ability to produce materials with a complex shape without theoretical restrictions and with added functionalities. There are several advantages to employing additive manufacturing as the primary additive manufacturing process. However, there exist several challenges that need to be addressed systematically. A couple such issues are alloy design and process development. Traditionally alloys designed for conventional cast/powder metallurgical processes were fabricated using advanced AM processes. This is the wrong approach considering that ...
This two-volume set (CCIS 158 and CCIS 159) constitutes the refereed proceedings of the International Workshop on Computer Science for Environmental Engineering and EcoInformatics, CSEEE 2011, held in Kunming, China, in July 2011. The 150 revised full papers presented in both volumes were carefully reviewed and selected from a large number of submissions. The papers are organized in topical sections on computational intelligence; computer simulation; computing practices and applications; ecoinformatics; image processing information retrieval; pattern recognition; wireless communication and mobile computing; artificial intelligence and pattern classification; computer networks and Web; computer software, data handling and applications; data communications; data mining; data processing and simulation; information systems; knowledge data engineering; multimedia applications.
This book presents high-quality papers from the Seventh Asia International Symposium on Mechatronics (AISM 2019). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design for electronic equipment, sensing and measurement, mechatronics in manufacturing and automation, micro-mechatronics, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed here provide excellent reference material for future product developments.
This book constitutes the thoroughly refereed post-proceedings of the 10th International Conference on Computer Supported Cooperative Work in Design, CSCWD 2006, held in Nanjing, China in May 2006. Among topics covered are CSCW techniques and methods, collaborative design, collaborative manufacturing and enterprise collaboration, Web services, knowledge management, security and privacy in CSCW systems, workflow management, and e-learning.