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Principles of Testing Electronic Systems
  • Language: en
  • Pages: 444

Principles of Testing Electronic Systems

A pragmatic approach to testing electronic systems As we move ahead in the electronic age, rapid changes in technology pose an ever-increasing number of challenges in testing electronic products. Many practicing engineers are involved in this arena, but few have a chance to study the field in a systematic way-learning takes place on the job. By covering the fundamental disciplines in detail, Principles of Testing Electronic Systems provides design engineers with the much-needed knowledge base. Divided into five major parts, this highly useful reference relates design and tests to the development of reliable electronic products; shows the main vehicles for design verification; examines design...

Design of Hardware/Software Embedded Systems
  • Language: en
  • Pages: 180

Design of Hardware/Software Embedded Systems

Este libro presenta los desafíos planteados por las nuevas y sumamente poderosas tecnologías de integración de sistemas electrónicos, que están en la base de los cambios sociales hacia lo que llaman la Sociedad de la Información; en la que los dispositivos electrónicos se harán una parte incorporada de la vida diaria, encajados en casi cada producto. Es necesario un conocimiento cuidadoso de los desafíos para aprovechar la amplia gama de ocasiones ofrecidas por tales capacidades de integración y las correspondientes posibilidades de diseño de sistemas electrónicos.

Power-Constrained Testing of VLSI Circuits
  • Language: en
  • Pages: 182

Power-Constrained Testing of VLSI Circuits

This text focuses on techniques for minimizing power dissipation during test application at logic and register-transfer levels of abstraction of the VLSI design flow. It surveys existing techniques and presents several test automation techniques for reducing power in scan-based sequential circuits and BIST data paths.

Cyber Physical Computing for IoT-driven Services
  • Language: en
  • Pages: 285

Cyber Physical Computing for IoT-driven Services

  • Type: Book
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  • Published: 2018-01-30
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  • Publisher: Springer

This book presents the cyber culture of micro, macro, cosmological, and virtual computing. The book shows how these work to formulate, explain, and predict the current processes and phenomena monitoring and controlling technology in the physical and virtual space.The authors posit a basic proposal to transform description of the function truth table and structure adjacency matrix to a qubit vector that focuses on memory-driven computing based on logic parallel operations performance. The authors offer a metric for the measurement of processes and phenomena in a cyberspace, and also the architecture of logic associative computing for decision-making and big data analysis.The book outlines an ...

VLSI: Integrated Systems on Silicon
  • Language: en
  • Pages: 569

VLSI: Integrated Systems on Silicon

  • Type: Book
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  • Published: 2013-06-05
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  • Publisher: Springer

This book contains the papers that have been presented at the ninth Very Large Scale Integrated Systems conference VLSI'97 that is organized biannually by IFIP Working Group 10.5. It took place at Hotel Serra Azul, in Gramado Brazil from 26-30 August 1997. Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble and Tokyo. The papers in this book report on all aspects of importance to the design of the current and future integrated systems. The current trend towards the realization of versatile Systems-on-a-Chip require attention of embedded hardware/software systems, dedicated ASIC hardware, sensors and actuators, mixed analog/digital design, video and imag...

VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
  • Language: en
  • Pages: 271

VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things

  • Type: Book
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  • Published: 2019-05-16
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  • Publisher: Springer

This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.

Official Gazette of the United States Patent and Trademark Office
  • Language: en
  • Pages: 1434

Official Gazette of the United States Patent and Trademark Office

  • Type: Book
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  • Published: 2001
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  • Publisher: Unknown

None

Conference proceedings. ICT for language learning
  • Language: en
  • Pages: 578

Conference proceedings. ICT for language learning

None

Leveraging Applications of Formal Methods
  • Language: en
  • Pages: 205

Leveraging Applications of Formal Methods

  • Type: Book
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  • Published: 2006-11-02
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  • Publisher: Springer

This book constitutes the thoroughly refereed post-proceedings of the First International Symposium on Leveraging Applications of Formal Methods, ISoLA 2004, held in Paphos, Cyprus in October/November 2004. The 12 revised full papers discuss issues related to the adoption and use of rigorous tools and methods for the specification, analysis, verification, certification, construction, test, and maintenance of systems.

Thermal Issues in Testing of Advanced Systems on Chip
  • Language: en
  • Pages: 219

Thermal Issues in Testing of Advanced Systems on Chip

Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations...