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Ch. 1. Anatomy of the knee / Bradley J. Margo, Craig S. Radnay and Giles R. Scuderi -- ch. 2. Physical examination of the knee / Qing Liu and Yixin Zhou -- ch. 3. Biomechanics of the knee and alignment / Jan M.K. Victor -- ch. 4. Imaging of the knee / Kevin R. Math and Vladimir Merunka -- ch. 5. The pediatric knee / David P. Roye, Jr. and Omar Jameel -- ch. 6. Surgical approaches / Aree Tanavalee -- ch. 7A. Cartilage injuries / Kevin D. Plancher and Sheryl L. Lipnick -- ch. 7B. Meniscal injuries / Kevin D. Plancher and Sheryl L. Lipnick -- ch. 8. Disorders of the patellofemoral joint / David R. Diduch and Andy Gerdemant -- ch. 9A. ACL Injuries and treatment / Antonia F. Chen [und weitere] --...
This book covers pertinent principles and practical surgical techniques related to primary total hip arthroplasty (THA) including complex cases. Written by experienced hip and knee surgeons, this book introduces the basic concepts of THA, helping the reader understand the basic science and history of THA. More chapters cover the preoperative planning and preparation, exposure using the various approaches, together with tips and tricks to position implants properly. Navigation-guided and robotic THA techniques are also included. Complications related to surgery, such as leg-length discrepancy, periprosthetic infections and fractures, hip instability, and deep vein thrombosis, are further discussed. Complex situations in specific diseases and pathology, such as rheumatoid hip arthritis, ankylosis spondylitis, and post-traumatic arthritic hip diseases are demonstrated.
With the world facing increasingly serious global climate change and resource scarcity issues, ecology and the environment have received much attention in recent years. As a major factor in human activity, design plays an important part in protecting the environment, as does the role of digital technology in finding solutions to the pressing problems faced in this regard. This book presents the proceedings of ISWED2023, the International Symposium on World Ecological Design, held on 17 December 2023 in Guangzhou, China. Sponsored by the World Eco-Design Conference (a UN Consultative NGO), the conference provides a platform for professionals and researchers from industry and academia to prese...
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From the reviews: "Bishop and Schroder (both, Univ. of Nebraska at Omaha) have brought together an impressive group of practitioners in the relatively new application of geographic information science to mountain geomorphology. In doing so, they have produced valuable, first, overall coverage of a high-tech approach to mountain, three-dimensional research. More than 40 contributing authors discuss a wide range of related aspects.... The book is well bound and well produced; each chapter provides an extensive source of references. The numerous line drawings are clearly reproduced, although the mediocre quality of photographic reproduction limits the value of air photographs and satellite images. As is characteristic of many edited collections, there is some variation in chapter quality. Some of the writing is so dense that it requires minute concentration--one chapter, for instance, has 14 pages of references from a total of 43 pages. Nevertheless, this is a vital compendium for a rapidly expanding field of research. Summing Up: Recommended. Upper-division undergraduates through professionals." (J. D. Ives, Choice, March 2005)
This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
th On behalf of the organizing committee of the 13 International Conference on Biomedical Engineering, I extend our w- mest welcome to you. This series of conference began in 1983 and is jointly organized by the YLL School of Medicine and Faculty of Engineering of the National University of Singapore and the Biomedical Engineering Society (Singapore). First of all, I want to thank Mr Lim Chuan Poh, Chairman A*STAR who kindly agreed to be our Guest of Honour to give th the Opening Address amidst his busy schedule. I am delighted to report that the 13 ICBME has more than 600 participants from 40 countries. We have received very high quality papers and inevitably we had to turndown some papers....