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Carbon Nanotubes for Interconnects
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Physical Design for 3D Integrated Circuits
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Quantum Computing
This book provides readers with the current state-of-the-art research and technology on quantum computing. The authors provide design paradigms of quantum computing. Topics covered include multi-programming mechanisms on near-term quantum computing, Lagrange interpolation approach for the general parameter-shift rule, architecture-aware decomposition of quantum circuits, software for massively parallel quantum computing, machine learning in quantum annealing processors, quantum annealing for real-world machine learning applications, queuing theory models for (Fault-Tolerant) quantum circuits, machine learning for quantum circuit reliability assessment, and side-channel leakage in Suzuki stack circuits.
ETCMOS 2017 Final Program
Final program from the ETCMOS 2017 conference, May 28-30, 2017, in Warsaw, Poland.
CMOSET 2014 Final Program
Final program for the CMOSET 2014 conference
CMOSET 2014: Abstracts
A collection of abstracts for talks presented at the 2014 CMOS Emerging Technologies Research Symposium in Grenoble, France, July 6-8, 2014. The CMOS Emerging Technologies Research Symposium is a research and business event for those who want to discuss and find out about new exciting high tech opportunities. The conference provides researchers, companies and academic institutions with a platform for showcasing their technology, innovations, products and services. By bringing together people from all areas of the high tech arena, we create a stimulating common ground for exploring collaborations and encouraging discussions on emerging technologies.
VLSI-SoC: Technology Advancement on SoC Design
This book contains extended and revised versions of the best papers presented at the 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, held in Singapore, in October 2021*. The 12 full papers included in this volume were carefully reviewed and selected from the 44 papers (out of 75 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs. *The conference was held virtually.
CMOSET 2014 Vol. 6: Packaging, Materials and Energy Track
Presentation slides from the Plenary track at the 2014 CMOS Emerging Technologies Research conference in Grenoble, France.
