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Carbon Nanotubes for Interconnects
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Reviews and Perspectives in Neuromorphic Engineering: Novel Neuromorphic Computing Approaches
Frontiers in Neuroscience, Neuromorphic Engineering is delighted to present the ‘Reviews and Perspectives in’ series of article collections. Reviews and Perspectives in Neuromorphic Engineering: Novel Neuromorphic Computing Approaches Research Topic will publish high-quality scholarly reviews and perspective papers on key topics in Neuromorphic Computing. It aims to highlight recent advances in neuromorphic computing in software, hardware, and wetware whilst emphasizing important directions, novel and unconventional approaches, and new possibilities for future inquiries. The research presented will promote discussion in the neuromorphic computing community that will translate to best pra...
Quantum Computing
This book provides readers with the current state-of-the-art research and technology on quantum computing. The authors provide design paradigms of quantum computing. Topics covered include multi-programming mechanisms on near-term quantum computing, Lagrange interpolation approach for the general parameter-shift rule, architecture-aware decomposition of quantum circuits, software for massively parallel quantum computing, machine learning in quantum annealing processors, quantum annealing for real-world machine learning applications, queuing theory models for (Fault-Tolerant) quantum circuits, machine learning for quantum circuit reliability assessment, and side-channel leakage in Suzuki stack circuits.
Micro- and Nanoelectronics
Micro- and Nanoelectronics: Emerging Device Challenges and Solutions presents a comprehensive overview of the current state of the art of micro- and nanoelectronics, covering the field from fundamental science and material properties to novel ways of making nanodevices. Containing contributions from experts in both industry and academia, this cutting-edge text: Discusses emerging silicon devices for CMOS technologies, fully depleted device architectures, characteristics, and scaling Explains the specifics of silicon compound devices (SiGe, SiC) and their unique properties Explores various options for post-CMOS nanoelectronics, such as spintronic devices and nanoionic switches Describes the latest developments in carbon nanotubes, iii-v devices structures, and more Micro- and Nanoelectronics: Emerging Device Challenges and Solutions provides an excellent representation of a complex engineering field, examining emerging materials and device architecture alternatives with the potential to shape the future of nanotechnology.
CMOS
CMOS: Front-End Electronics for Radiation Sensors offers a comprehensive introduction to integrated front-end electronics for radiation detectors, focusing on devices that capture individual particles or photons and are used in nuclear and high energy physics, space instrumentation, medical physics, homeland security, and related fields. Emphasizing practical design and implementation, this book: Covers the fundamental principles of signal processing for radiation detectors Discusses the relevant analog building blocks used in the front-end electronics Employs systematically weak and moderate inversion regimes in circuit analysis Makes complex topics such as noise and circuit-weighting functions more accessible Includes numerical examples where appropriate CMOS: Front-End Electronics for Radiation Sensors provides specialized knowledge previously obtained only through the study of multiple technical and scientific papers. It is an ideal text for students of physics and electronics engineering, as well as a useful reference for experienced practitioners.
High Performance CMOS Range Imaging
This work is dedicated to CMOS based imaging with the emphasis on the noise modeling, characterization and optimization in order to contribute to the design of high performance imagers in general and range imagers in particular. CMOS is known to be superior to CCD due to its flexibility in terms of integration capabilities, but typically has to be enhanced to compete at parameters as for instance noise, dynamic range or spectral response. This work gathers the widespread theory on noise and extends the theory by a non-rigorous but potentially computing efficient algorithm to estimate noise in time sampled systems.
Physical Design for 3D Integrated Circuits
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
ETCMOS 2017 Final Program
Final program from the ETCMOS 2017 conference, May 28-30, 2017, in Warsaw, Poland.
VLSI
Recently the world celebrated the 60th anniversary of the invention of the first transistor. The first integrated circuit (IC) was built a decade later, with the first microprocessor designed in the early 1970s. Today, ICs are a part of nearly every aspect of our daily lives. They help us live longer and more comfortably, and do more, faster. All this is possible because of the relentless search for new materials, circuit designs, and ideas happening on a daily basis at industrial and academic institutions around the globe. Showcasing the latest advances in very-large-scale integrated (VLSI) circuits, VLSI: Circuits for Emerging Applications provides a balanced view of industrial and academi...
