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Device Applications of Nonlinear Dynamics
This book is devoted to applications of complex nonlinear dynamic phenomena to real systems and device applications. In recent decades there has been significant progress in the theory of nonlinear phenomena, but there are comparatively few devices that actually take this rich behavior into account. The text applies and exploits this knowledge to propose devices which operate more efficiently and cheaply, while affording the promise of much better performance.
Inorganic Glasses for Photonics
Advanced textbook on inorganic glasses suitable for both undergraduates and researchers. Engaging style to facilitate understanding Suitable for senior undergraduates, postgraduates and researchers entering material science, engineering, physics, chemistry, optics and photonics fields Discusses new techniques in optics and photonics including updates on diagnostic techniques Comprehensive and logically structured
Advanced Electronic Packaging
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Ceramic Interconnect Technology Handbook
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design...
Surfaces and Interfaces in Nanostructured Materials and Trends in LIGA, Miniaturization, and Nanoscale Materials
At head of title: MPMD Fifth Global Innovations Proceedings.
Thin Film Technology Handbook
The most comprehensive source available on the preparation, characterization, and emerging applications of thin film. This book features extensive new advances applied in multichip modules (MCMs), and covers the basic principles and applications of thin film deposition techniques for practical use. It provides and develops design guidelines to realize multilayer structures in microcircuits, thus addressing a critical and rapidly growing area.
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