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An Introduction to Stein's Method
  • Language: en
  • Pages: 240

An Introduction to Stein's Method

A common theme in probability theory is the approximation of complicated probability distributions by simpler ones, the central limit theorem being a classical example. Stein's method is a tool which makes this possible in a wide variety of situations. Traditional approaches, for example using Fourier analysis, become awkward to carry through in situations in which dependence plays an important part, whereas Stein's method can often still be applied to great effect. In addition, the method delivers estimates for the error in the approximation, and not just a proof of convergence. Nor is there in principle any restriction on the distribution to be approximated; it can equally well be normal, ...

Therapeutic Interventions in Patients with CHD
  • Language: en
  • Pages: 172

Therapeutic Interventions in Patients with CHD

  • Type: Book
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  • Published: 1990
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  • Publisher: Unknown

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Strain comparisons in aquaculture species
  • Language: en
  • Pages: 32

Strain comparisons in aquaculture species

  • Type: Book
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  • Published: Unknown
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  • Publisher: WorldFish

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Strain Patterns in Rocks
  • Language: en
  • Pages: 253

Strain Patterns in Rocks

  • Type: Book
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  • Published: 2015-12-04
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  • Publisher: Elsevier

Strain Patterns in Rocks is a selection of papers presented at the international workshop, held in Rennes on May 13-14, 1982. The book presents papers on the techniques of strain measurement; an orthographic analysis of deformation; and the applications of the Mohr circle to inhomogeneous deformation. The text also includes papers on the methods of strain removal; a general transformation to simulate heterogeneous strain states; the significance of isotropic points; and the detection of volume changes. Papers on the analyses of strain discontinuity at interfaces; strain refraction through contrasting layers; and strain patterns in ductile shear zones and at the tips to shear and thrust zones are also considered. The book further includes papers on the natural strain patterns: in mylonite zones, in granites, in Alpine nappes, in linearly anisotropic rocks, in an ice cap and in a boudin model.

Constitutive Relation in High/Very High Strain Rates
  • Language: en
  • Pages: 259

Constitutive Relation in High/Very High Strain Rates

The IUTAM Symposium on Constitutive Relation in High/Very High Strain Rates (CRHVHSR) was held October 16 - 19, 1995, at Seminar House, Science University of Tokyo, under the sponsorship of IUTAM, Japan Society for the Promotion of Science, The Commemorative Association for the Japan World Exposition (1970), Inoue Foundation for Science, The Japan Society for Aeronautical and Space Sciences, and Science University of Tokyo. The proposal to hold the symposium was accepted by the General Assembly of IUT AM held in Haifa, Israel, in August 1992, and the scientists mentioned below were appointed by the Bureau of IUTAM to serve as members of the Scientific Committee. The main object of the sympos...

Disorder and Strain-Induced Complexity in Functional Materials
  • Language: en
  • Pages: 316

Disorder and Strain-Induced Complexity in Functional Materials

This book brings together an emerging consensus on our understanding of the complex functional materials including ferroics, perovskites, multiferroics, CMR and high-temperature superconductors. The common theme is the existence of many competing ground states and frustration as a collusion of spin, charge, orbital and lattice degrees of freedom in the presence of disorder and (both dipolar and elastic) long-range forces. An important consequence of the complex unit cell and the competing interactions is that the emergent materials properties are very sensitive to external fields thus rendering these materials with highly desirable, technologically important applications enabled by cross-response.

Technology and Practical Use of Strain Gages
  • Language: en
  • Pages: 471

Technology and Practical Use of Strain Gages

Das vorliegende Buch ist ein umfassendes grundlegendes Kompendium über Dehnungsmessstreifen (DMS) und ihre Anwendung in der Materialwissenschaft und Werkstofftechnik sowie in allen Bereichen des Ingenieurwesens. Es deckt sowohl die theoretischen als auch die praktischen Aspekte der Spannungsanalyse mithilfe von Dehnungsmessstreifen ab. Ein historischer Rückblick auf die Erfindung und Entwicklung von DMS fasst das "Wer, Wann und Wie" zusammen. Die umfassende Bibliographie führt zu zusätzlichen Hintergrundinformationen. Besonderes Augenmerk gilt der Spannungsanalyse zur Bestimmung der mechanischen Eigenschaften, der Tragfähigkeit und der Gebrauchstauglichkeit von Bauteilen sowie zur Planu...

Stein Manifolds and Holomorphic Mappings
  • Language: en
  • Pages: 501

Stein Manifolds and Holomorphic Mappings

The main theme of this book is the homotopy principle for holomorphic mappings from Stein manifolds to the newly introduced class of Oka manifolds. The book contains the first complete account of Oka-Grauert theory and its modern extensions, initiated by Mikhail Gromov and developed in the last decade by the author and his collaborators. Included is the first systematic presentation of the theory of holomorphic automorphisms of complex Euclidean spaces, a survey on Stein neighborhoods, connections between the geometry of Stein surfaces and Seiberg-Witten theory, and a wide variety of applications ranging from classical to contemporary.

The Influence of Crack Length and Thickness in Plane Strain Fracture Toughness Tests
  • Language: en
  • Pages: 40
Thermal Stress and Strain in Microelectronics Packaging
  • Language: en
  • Pages: 904

Thermal Stress and Strain in Microelectronics Packaging

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development effor...