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Power Integrity Modeling and Design for Semiconductors and Systems
  • Language: en
  • Pages: 597

Power Integrity Modeling and Design for Semiconductors and Systems

The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introdu...

Modeling of Lossy Interconnects and Packages with Non-ideal Power, Ground Planes
  • Language: en
  • Pages: 131

Modeling of Lossy Interconnects and Packages with Non-ideal Power, Ground Planes

  • Type: Book
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  • Published: 2004
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  • Publisher: Unknown

None

Design And Modeling For 3d Ics And Interposers
  • Language: en
  • Pages: 379

Design And Modeling For 3d Ics And Interposers

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates
  • Language: en
  • Pages: 226

Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates

This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.

Engineering Societies in the Agents World VI
  • Language: en
  • Pages: 314

Engineering Societies in the Agents World VI

  • Type: Book
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  • Published: 2006-06-02
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  • Publisher: Springer

This book constitutes the thoroughly refereed post-proceedings of the 6th International Workshop on Engineering Societies in the Agents World, ESAW 2005. The book presents 15 revised full papers together with 3 invited papers, organized in topical sections on agent oriented system development, methodologies for agent societies, deliberative agents and social aspect, agent oriented simulation, adaptive systems, coordination, negotiation, protocols, and agents, networks and ambient intelligence.

Power Distribution Network Design Methodologies
  • Language: en
  • Pages: 578

Power Distribution Network Design Methodologies

A series of cogently written articles by 49 industry experts, this collection fills the void on Power Distribution Network (PDN) design procedures, and addresses such related topics as DC–DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, and synthesis of impedance profiles. Through these contributions from such leading companies as Sun Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, readers will come to understand why books on power integrity are only now becoming available to the public and can relate these topics to current industry trends.

Electrical Modeling and Design for 3D System Integration
  • Language: en
  • Pages: 394

Electrical Modeling and Design for 3D System Integration

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophis...

Issues in Chemical Engineering and other Chemistry Specialties: 2013 Edition
  • Language: en
  • Pages: 1201

Issues in Chemical Engineering and other Chemistry Specialties: 2013 Edition

Issues in Chemical Engineering and other Chemistry Specialties: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Chemical Modeling. The editors have built Issues in Chemical Engineering and other Chemistry Specialties: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Chemical Modeling in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issues in Chemical Engineering and other Chemistry Specialties: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

Issues in Chemical Engineering and other Chemistry Specialties: 2011 Edition
  • Language: en
  • Pages: 2998

Issues in Chemical Engineering and other Chemistry Specialties: 2011 Edition

Issues in Chemical Engineering and other Chemistry Specialties: 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Chemical Engineering and other Chemistry Specialties. The editors have built Issues in Chemical Engineering and other Chemistry Specialties: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Chemical Engineering and other Chemistry Specialties in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issues in Chemical Engineering and other Chemistry Specialties: 2011 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

Genetic Engineering in Livestock
  • Language: en
  • Pages: 156

Genetic Engineering in Livestock

Upcoming applications of genetic engineering in farm animals include higher yields, leaner meat, or disease resistance. The proceedings cover an analysis of the state of the art of the technology and its applications, an introduction to the specific application zoopharming (a method to produce biopharmaceuticals in transgenic livestock), including an analysis of the market for biopharmaceuticals. In addition an assessment of ethical aspects of livestock biotechnology and considerations regarding animal welfare implications are covered. The study is addressed to science, industry and politics.