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Wire Bonding in Microelectronics
The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAG...
WIRE BONDING IN MICROELECTRONICS, 3/E
The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAG...
Ire Bonding in Microelectronics
The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information covering new materials and techniques such as fine pitch
Application of Capacitor Microphones and Magnetic Pickups to the Tuning and Trouble Shooting of Microelectronic Ultrasonic Bonding Equipment
Microelectronic ultrasonic wire bonding equipment typically welds wires to integrated circuits at frequencies between 50 and 65 kHz. Mechanical vibrations at these frequencies are difficult to measure directly and malfunctions of the system may not be recognized. Two different methods of measuring these vibrations are described. The first method involves use of a capacitor microphone and a tapered tip, and the second method use of a small magnetic pickup. Procedures are given for establishing a specific ultrasonic vibration amplitude, tuning the ultrasonic system to resonance, and diagnosing both mechanical and electrical problems in wire bonding equipment. Although these techniques and procedures were developed for ultrasonic wire bonding equipment, they are applicable to other ultrasonic welding systems of lead attachment, such as flip-chip, beam lead and spider bonding.
Specification of George Harman Barth
Patent for "apparatus for administering and supplying and purifying gases or vapours for medicinal and other purposes".
