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Electrical Characterisation of Ferroelectric Field Effect Transistors based on Ferroelectric HfO2 Thin Films
Ferroelectric field effect transistor (FeFET) memories based on a new type of ferroelectric material (silicon doped hafnium oxide) were studied within the scope of the present work. Utilisation of silicon doped hafnium oxide (Si:HfO2 thin films instead of conventional perovskite ferroelectrics as a functional layer in FeFETs provides compatibility to the CMOS process as well as improved device scalability. The influence of different process parameters on the properties of Si:HfO2 thin films was analysed in order to gain better insight into the occurrence of ferroelectricity in this system. A subsequent examination of the potential of this material as well as its possible limitations with the respect to the application in non-volatile memories followed. The Si:HfO2-based ferroelectric transistors that were fully integrated into the state-of-the-art high-k metal gate CMOS technology were studied in this work for the first time. The memory performance of these devices scaled down to 28 nm gate length was investigated. Special attention was paid to the charge trapping phenomenon shown to significantly affect the device behaviour.
Development of HfO2-Based Ferroelectric Memories for Future CMOS Technology Nodes
This thesis evaluates the viability of ferroelectric Si:HfO2 and its derived FeFET application for non-volatile data storage. At the beginning, the ferroelectric effect is explained briefly such that the applications that make use of it can be understood. Afterwards, the latest findings on ferroelectric HfO2 are reviewed and their potential impact on future applications is discussed. Experimental data is presented afterwards focusing on the ferroelectric material characteristics of Si:HfO2 that are most relevant for memory applications. Besides others, the stability of the ferroelectric switching effect could be demonstrated in a temperature range of almost 400 K. Moreover, nanosecond switch...
Design Automation and Applications for Emerging Reconfigurable Nanotechnologies
This book is a single-source solution for anyone who is interested in exploring emerging reconfigurable nanotechnology at the circuit level. It lays down a solid foundation for circuits based on this technology having considered both manual as well as automated design flows. The authors discuss the entire design flow, consisting of both logic and physical synthesis for reconfigurable nanotechnology-based circuits. The authors describe how transistor reconfigurable properties can be exploited at the logic level to have a more efficient circuit design flow, as compared to conventional design flows suited for CMOS. Further, the book provides insights into hardware security features that can be intrinsically developed using the runtime reconfigurable features of this nanotechnology.
Sub-Micron Semiconductor Devices
This comprehensive reference text discusses novel semiconductor devices, including nanostructure field-effect transistors, photodiodes, high electron mobility transistors, and oxide-based devices. The text covers submicron semiconductor devices, device modeling, novel materials for devices, novel semiconductor devices, optimization techniques, and their application in detail. It covers such important topics as negative capacitance devices, surface-plasmon resonance devices, Fermi-level pinning, external stimuli-based optimization techniques, optoelectronic devices, and architecture-based optimization techniques. The book: Covers novel semiconductor devices with submicron dimensions Discusses comprehensive device optimization techniques Examines conceptualization and modeling of semiconductor devices Covers circuit and sensor-based application of the novel devices Discusses novel materials for next-generation devices This text will be useful for graduate students and professionals in fields including electrical engineering, electronics and communication engineering, materials science, and nanoscience.
Ultrathin Calcium Titanate Capacitors
To enable further scaling for future generations of DRAM capacitors, significant efforts to replace Zirconium dioxide as high-k dielectric have been undertaken since the 1990s. In calculations, Calcium titanate has been identified as a potential replacement to allow a significant capacitance improvement. This material exhibits a significantly higher permittivity and a sufficient band gap. The scope of this thesis is therefore the preparation and detailed physical and electrical characterization of ultrathin Calcium titanate layers. The complete capacitor stacks including Calcium titanate have been prepared under ultrahigh vacuum to minimize the influence of adsorbents or contaminants at the ...
