Welcome to our book review site go-pdf.online!

You may have to Search all our reviewed books and magazines, click the sign up button below to create a free account.

Sign up

Silicon Materials Science and Technology
  • Language: en
  • Pages: 800

Silicon Materials Science and Technology

  • Type: Book
  • -
  • Published: 1998
  • -
  • Publisher: Unknown

None

Wafer Bonding
  • Language: en
  • Pages: 510

Wafer Bonding

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Into The Nano Era
  • Language: en
  • Pages: 364

Into The Nano Era

Even as we tentatively enter the nanotechnology era, we are now encountering the 50th anniversary of the invention of the IC. Will silicon continue to be the pre-eminent material and will Moore’s Law continue unabated, albeit in a broader economic venue, in the nanotechnology era? This monograph addresses these issues by a re-examination of the scientific and technological foundations of the micro-electronics era. It also features two visionary articles of Nobel laureates.

Annual Report
  • Language: en
  • Pages: 430

Annual Report

  • Type: Book
  • -
  • Published: 1897
  • -
  • Publisher: Unknown

Contains also Proceedings of conferences of health officers, and lists of physicians.

Handbook of Wafer Bonding
  • Language: en
  • Pages: 435

Handbook of Wafer Bonding

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Gallium Nitride and Silicon Carbide Power Technologies
  • Language: en
  • Pages: 361
Semiconductor Wafer Bonding
  • Language: en
  • Pages: 310

Semiconductor Wafer Bonding

None

Novel Aspects of Diamond II
  • Language: en
  • Pages: 530

Novel Aspects of Diamond II

This edited book covers a wide range of novel scientific and engineering aspects of diamond films produced from chemical vapor deposition. It focuses on the most recent developments and achievements in this rapidly growing field from scientists and engineers across the domains of chemistry, biology, medicine, physics, and semiconductor engineering. The latest volume of this consistently well-cited book brings an updated, systematic review of the latest developments in diamond research and application. Featuring contributed chapters from a mix of highly-active international researchers, this new edition presents recent research focusing on topics such as diamond for thermal management in high-power electronics, diamond MOSFETs, water treatment, application of machine learning for nanodiamonds, theoretical aspects of diamond growth, current trends in emerging diamond technologies, and the growth of doped single-crystal diamond. This book is especially appealing to interdisciplinary researchers and industry professionals working on advanced diamond devices and applications, as well as theoretical and computational methods for predicting and designing new diamond materials.

Nanoelectronics and Information Technology
  • Language: en
  • Pages: 1041

Nanoelectronics and Information Technology

Fachlich auf höchstem Niveau, visuell überzeugend und durchgängig farbig illustriert: Das ist die neue Auflage der praxisbewährten Einführung in spezialisierte elektronische Materialien und Bauelemente aus der Informationstechnologie. Über ein Drittel des Inhalts ist neu, alle anderen Beiträge wurden gründlich überarbeitet und aktualisiert.