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International Monetary Economics
Containing Fritz Machlup's papers on international finance spanning thirty years, this volume includes pieces translated into English for the first time. Focussing on the theme of the balance of payments, the work is structured as follows: Foreign Exchanges and Balance of Payments, The Effects of Devaluation, Gold and Foreign Reserves, Capital Movements and the Transfer Problem. An introduction to each section by the author is included.
Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, Volume 3
This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003.This volume is divided into three parts. Part 1. a Synthesis, Properties and Bulk Characterizationa ; Part 2 a Hybrids and Compositesa
The Geography of Southeast Asia
In The Geography of Southeast Asia, Rumney discusses an area that has long been of interest to geographers and other academics. As interest in Southeast Asia has grown, particularly over the past forty years, the volume and variety of scholarly publications on the varied geographical aspects of the region have also increased. This collection is an attempt to identify, organize, and present as many of these works as possible. The region as a whole, and each individual country of the area, are covered in individual chapters. Each chapter is further systematically organized by topic, including general works, cultural-social geography, economic geography, historical geography, physical geography, political geography, and urban geography. This book presents a myriad of sources, such as atlases, books, chapters, articles, dissertations, and theses are included, as well as works written in English, French, German, and other languages, providing the reader with a thorough view of Southeast Asian geography.
Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9
This issue of ECS Transactions includes papers based on presentations from the symposium "Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9," originally held at the 235th ECS Meeting in Dallas, Texas, May 26-30, 2019.
